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Notes / PCB Design

Decoupling placement: close and short

A decoupling capacitor supplies the current a chip pulls in an instant. Position and vias decide the effect more than the value does.

GROUND EMBEDDED · NOTEPCB Design 05Decoupling placementMCU

When an MCU pulls hundreds of mA for an instant on every clock, the distant regulator cannot supply it straight away because of trace inductance. The capacitor right next to the chip covers that instant.

Placement principles

Power planeViaDecoupling capacitorclosest to the pinIC power pin
Place it so current passes the capacitor before entering the pin.
  1. 100 nF for every power pin, within 2 mm of the pin
  2. A short, thick trace from capacitor to pin
  3. From the capacitor's ground pad, straight through a via to the ground plane
  4. Current passes in the order supply → capacitor → chip pin

Combination of values

Value Role
100 nF (each pin) Noise from a few to tens of MHz
1 to 10 µF (per chip) The hundreds-of-kHz band, load changes
Tens to hundreds of µF (board input) Low-frequency bulk

For small capacitances a small package (0402) has less parasitic inductance and is better at high frequency.

Common mistakes

  • The capacitor is close but its ground via is far away → the loop grows and the effect is halved
  • Several pins share one capacitor
  • Decoupling or a filter bead left off VDDA (analog supply) → ADC noise
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